X-ray imaging contract service for non-destructive testing of solder joint conditions, etc.
We also accept X-ray imaging of equipment and embedded boards designed and manufactured by our company, as well as boards implemented by other companies. Please feel free to consult with us.
We will take images of areas that are difficult to observe through visual inspection, such as the solder joint condition of leadless components mounted on the substrate and cable disconnections, using the X-ray inspection equipment we possess, and provide you with the image data. Please use this for quality control of products and identification of defective areas. 【Examples】 ■ Confirmation of solder joint condition of BGA mounted on the substrate ■ Detection of defects in solder joints (unconnected, bridging, voids, etc.) ■ Pattern inspection and defect detection of printed circuit boards ■ Detection of disconnections in flexible substrates ■ Detection of disconnections in cables and harnesses ■ Observation of internal structures and defects of products and electronic components ■ Detection of foreign matter contamination inside products *For more details, please download the PDF or feel free to contact us.
- 企業：新日本電子 本社
- 価格：Other
